Details

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Introduction:

The Touch Screen Internal Ply Bond Tester is a precision engineering instrument specifically designed to quantify the internal fiber bonding strength of paper, board, and other sheet materials. Adhering strictly to TAPPI T569, this system is essential for quality control and R&D laboratories aiming to predict material performance during high-speed converting, printing, and finishing processes.

The Science of the Test
This tester operates on the proven falling pendulum principle to simulate high-velocity impact forces:

Specimen Preparation: The sample is securely sandwiched between two substrates coated with high-tack double-sided tape (Figure 1), ensuring that the surface layers are held firmly during the test.

High-Speed Impact: A calibrated pendulum swings downward, striking the tape assembly at a controlled, high rate of speed (Figure 2). This sudden impact creates a tensile stress perpendicular to the sheet surface.

Measurement: The system measures the total kinetic energy absorbed by the specimen during the delamination event. This energy reading directly corresponds to the work required to split the internal fibers of the paper in the "Z-direction" (the thickness axis), forcing the single specimen to separate into two distinct piles
 

Applications:

Corrugated Board: Evaluating the ply adhesion to prevent delamination during fluting and laminating.
Coated Papers: Assessing the coating bond strength to avoid blistering in offset printing.
Tissue & Linerboard: Ensuring structural integrity during high-speed rewinding and converting.

Specification

Model	EI-IBT
Measuring Range	Range - A (20 ~ 500 J/m²) Range - B (500 ~ 1000 J/m²)
Sample Clamping Load	0 ~ 400N (adjustable)
Resolution	0.001lbf/in²
Impact Angle	90°
Unit Measuring	J/M² , lbf/in²  interchangeable
Sample Dimension	25.4 x 25.4 mm
Number of Samples	5 pieces
Display	Touch Screen
Printer	Build-in Thermal Printer
Power	240V, 50Hz
Dimension	500 (W) x 400 (D) x 650 (H) mm
Weight	Approx. 70kg